DDR2 / DDR3 / DDR4 / DDR5 / LP2 / LP4 / LP5

Burn in; Core; Speed; Module

SSD / Micro SD / U-Disk / CF Card / UDP / eMMC

Burn in; Core; Speed; Module

FCCSP / FCBGA / Hybrid FCCSP + MUF

Digital; Wireless/RF; SoC; Power/Analog

Lead frame design

Bonding diagram generation

POD Drawing creation etc.

SSD / Micro SD / U-Disk / CF Card / UDP / eMMC

Burn in; Core; Speed; Module

Junction to ambient thermal resistance

Junction to board thermal resistance

Junction to case thermal resistance